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hsmx-a10x-xxxxx plcc-2, surface mount led indicator data sheet caution: hsmn,m,k and e-a10x-xxxxx leds are class 2 esd sensitive. please observe appropriate precau - tions during handling and processing. refer to avago application note an-1142 for additional details. description this family of smt leds is packaged in the industry standard plcc-2 package. these smt leds have high reliability performance and are designed to work under a wide range of environmental conditions. this high reliability feature makes them ideally suited to be used under harsh interior automotive as well as interior signs application conditions. to facilitate easy pick & place assembly, the leds are packed in eia-compliant tape and reel. every reel will be shipped in single intensity and color bin, except red color, to provide close uniformity. these leds are compatible with ir solder refow process. due to the high reliability feature of these products, they can also be mounted using through-the-wave soldering process. the super wide viewing angle at 120? makes these leds ideally suited for panel, push button, or general backlighting in automotive interior, ofce equipment, industrial equipment, and home appliances. the fat top emitting surface makes it easy for these leds to mate with light pipes. with the built-in refector pushing up the intensity of the light output, these leds are also suitable to be used as led pixels in interior elec - tronic signs. features ? industry standard plcc-2 package ? high reliability led package ? high brightness using alingap and ingan dice tech - nologies ? available in full selection of colors ? super wide viewing angle at 120? ? available in 8 mm carrier tape on 7 inch reel (2000 pieces) ? compatible with both ir and ttw soldering process applications ? interior automotive C instrument panel backlighting C central console backlighting C cabin backlighting ? electronic signs and signals C interior full color sign C variable message sign ? ofce automation, home appliances, industrial equipment C front panel backlighting C push button backlighting C display backlighting
2 package dimensions 0.8 0.3 3.5 0.2 2.8 0.2 0.5 0.1 3.2 0.2 2.2 0.2 1.9 0.2 0.1 typ. 0.8 0.1 cathode marking (anode marking for algaas devices) 5.2 0.2 2.8 0.2 0.5 0.1 0.1 typ. 3.2 0.2 2.2 0.2 1.9 0.2 cathode marking note: all dimensions in millimeters. top mount reverse mount
3 table 1. device selection guide red part number min iv (mcd) typ. iv (mcd) max. iv (mcd) test current (ma) dice technology hsms-a100-j00j1 4.50 15.00 - 20 gap hsms-a100-l00j1 11.20 15.00 - 20 gap hsms-a100-h70j2 3.55 - 7.20 10 gap hsms-a100-j80j2 5.60 - 14.00 10 gap hsmh-a100-l00j1 11.20 15.00 - 20 algaas hsmh-a100-n00j1 28.50 50.00 - 20 algaas hsmh-a100-m80j2 22.40 - 56.00 10 algaas hsmc-a100-q00j1 71.50 100.00 - 20 alingap hsmc-a100-r00j1 112.50 140.00 - 20 alingap hsmc-a101-s00j1 180.00 220.00 - 20 alingap hsmz-a100-t00j1 285.00 350.00 - 20 alingap hsmc-a100-p30j1 45.00 - 90.00 20 alingap red orange part number min iv (mcd) typ. iv (mcd) max. iv (mcd) test current (ma) dice technology hsmj-a100-q00j1 71.50 100.00 - 20 alingap hsmj-a101-s00j1 180.00 200.00 - 20 alingap hsmv-a100-t00j1 285.00 350.00 - 20 alingap hsmj-a100-r40j1 112.50 - 285.00 20 alingap hsmv-a100-s80j1 224.00 - 560.00 20 alingap orange part number min iv (mcd) typ. iv (mcd) max. iv (mcd) test current (ma) dice technology hsmd-a100-j00j1 4.50 15.00 - 20 gap hsmd-a100-l00j1 11.20 15.00 - 20 gap HSMD-A100-K4PJ2 7.20 - 18.00 10 gap hsml-a100-q00j1 71.50 100.00 - 20 alingap hsml-a101-s00j1 180.00 220.00 - 20 alingap
4 yellow / amber part number min iv (mcd) typ. iv (mcd) max. iv (mcd) test current (ma) dice technology hsmy-a100-j00j1 4.50 12.00 - 20 gap hsmy-a100-l00j1 11.20 12.00 - 20 gap hsmy-a100-j35j2 4.50 - 9.00 10 gap hsma-a100-q00j1 71.50 100.00 - 20 alingap hsma-a101-s00j1 180.00 220.00 - 20 alingap hsmu-a100-s00j1 180.00 320.00 - 20 alingap hsma-a101-r8wj1 140.00 - 355.00 20 alingap hsmu-a100-s4wj1 180.00 - 450.00 20 alingap yellow green part number min iv (mcd) typ. iv (mcd) max. iv (mcd) test current (ma) dice technology hsmg-a100-j02j1 4.50 18.00 - 20 gap hsmg-a100-k72j2 9.00 - 18.00 10 gap hsme-a100-m02j1 18.00 70.00 - 20 alingap hsme-a100-n82j1 35.50 - 90.00 20 alingap emerald green part number min iv (mcd) typ. iv (mcd) max. iv (mcd) test current (ma) dice technology hsmg-a100-h01j1 2.80 8.00 - 20 gap hsmg-a100-h41j2 2.80 - 7.20 10 gap hsme-a100-l01j1 11.20 40.00 - 20 alingap hsme-a100-m3pj1 18.00 - 35.50 20 alingap green part number min iv (mcd) typ. iv (mcd) max. iv (mcd) test current (ma) dice technology hsmm-a101-r00j1 112.50 200.00 - 20 ingan hsmm-a100-s00j1 180.00 350.00 - 20 ingan hsmm-a100-u4pj1 450.00 - 1125.00 20 ingan hsmm-a100-v7pj1 900.00 - 1800.00 20 ingan blue part number min iv (mcd) typ. iv (mcd) max. iv (mcd) test current (ma) dice technology hsmn-a101-n00j1 28.50 50.00 - 20 ingan hsmn-a100-p00j1 45.00 70.00 - 20 ingan hsmn-a100-r4yj1 112.50 - 285.00 20 ingan notes: 1. the luminous intensity iv, is measured at the mechanical axis of the lamp package. the actual peak of the spatial radiation pattern may not be aligned with this axis. 2. iv tolerance = 12%
5 part numbering system packaging option color bin selection intensity bin select device specifc confguration package type led chip color hsm x 1 - a x 2 x 3 x 4 - x 5 x 6 x 7 x 8 x 9 absolute maximum ratings (t a = 25c) parameters hsms/d/y/g hsmh hsmc/j/l/a hsme hsmz/v/u hsmm/k/b/n dc forward current [1] 30 ma 30 ma 30 ma [3,4] 20 ma [4] 30 ma [3,4] 30 ma peak forward current [2] 100 ma 100 ma 100 ma 100 ma 100 ma 100 ma power dissipation 63 mw 60 mw 63 mw 48 mw 72 mw 114 mw reverse voltage 5 v junction temperature 110c operating temperature C55c to +100c storage temperature C55c to +100c notes: 1. derate linearly as shown in figure 4. 2. duty factor = 10%, frequency = 1 khz. 3. drive current between 10 ma and 30 ma is recommended for best long term performance. 4. operation at current below 5 ma is not recommended.
6 electrical characteristics (t a = 25?c) forward voltage reverse voltage reverse voltage thermal v f (volts) @ i f = 20 ma v r @ 100 a v r @ 10 a resistance part number typ. max. min. min. r jp (c/w) hsms/d/y/g 2.2 2.6 5 180 hsmh 1.9 2.6 5 180 hsmc/j/l/a/e 1.9 2.4 5 280 hsmz/v/u 2.2 2.6 5 280 hsmb 3.9 4.3 5 280 hsmm/k/n 3.4 4.05 5 280 optical characteristics (t a = 25?c) viewing luminous peak dominant angle luminous intensity/ wavelength wavelength [1] 2 1/2 [2] efcacy v [3] total flux dice peak (nm) d (nm) (degrees) (lm/w) i v (mcd)/ v (mlm) color part number technology typ. typ. typ. typ. typ. red hsms-a100 gap 635 626 120 120 0.45 hsmh-a100 algaas 645 637 120 63 0.45 hsmc-a10x alingap 635 626 120 150 0.45 hsmz-a100 alingap 639 630 120 155 0.45 red hsmj-a10x alingap 621 615 120 240 0.45 orange hsmv-a100 alingap 623 617 120 263 0.45 orange hsmd-a100 gap 600 602 120 380 0.45 hsml-a10x alingap 609 605 120 320 0.45 amber hsmy-a100 gap 583 585 120 520 0.45 hsma-a10x alingap 592 590 120 480 0.45 hsmu-a100 alingap 594 592 120 500 0.45 yellow hsmg-a100 gap 565 569 120 590 0.45 green hsme-a100 alingap 575 570 120 560 0.45 emerald hsmg-a100 gap 558 560 120 650 0.45 green hsme-a100 alingap 566 560 120 610 0.45 green hsmm-a10x ingan 523 525 120 500 0.45 cyan hsmk-a10x ingan 502 505 120 300 0.45 blue hsmb-a100 gan 428 462 120 65 0.45 hsmn-a10x ingan 468 470 120 75 0.45 notes: 1. the dominant wavelength, d , is derived from the cie chromaticity diagram and represents the color of the device. 2. 1/2 is the of-axis angle where the luminous intensity is 1/2 the peak intensity. 3. radiant intensity, i e in watts/steradian, may be calculated from the equation i e = i v / v , where i v is the luminous intensity in candelas and v is the luminous efcacy in lumens/watt.
7 figure 1. relative intensity vs. wavelength. figure 2. forward current vs. forward voltage. figure 3. relative intensity vs. forward current. figure 4. maximum forward current vs. ambient temperature. derated based on t j max = 110?c, r ja = 500?c/w. figure 5. dominant wavelength vs. forward current C ingan devices. figure 4b. maximum forward current vs. solder point temperature. derated based on t j max = 110c, r jp = 180c/w or 280c/w. 0 5 10 15 20 25 30 35 0 20 40 60 80 100 120 temperature (c) current - ma hsms/d/g/ y/h/z/v/u hsme hsmm/k/b/n hsmc/j/l/a 0 5 10 15 20 25 30 35 0 20 40 60 80 100 120 temperature (c) current - ma hsms/d/g/y/h hsmc/j/l/a hsmz/v/u hsmb hsmm/k/n hsme 0 20 current ? ma 460 480 540 dominant wavelength ? nm hsmx-a100 g 5 35 500 470 510 10 490 520 25 green 5 15 30 530 cyan blue wavelength ? nm hsmx-a100 g 1 emerald green relative intensity 1.0 0.8 0 380 480 580 680 730 780 630 530 430 blue cyan 0.6 0.4 0.2 green yellow green amber orange red orange red 0.1 0.3 0.5 0.7 0.9 wavelength ? nm hsmx-a100 g 1b relative intensity 1.0 0.8 0 380 480 580 680 730 780 630 530 430 gan blue gap emerald green gap orange gap red 0.6 0.4 0.2 gap yellow gap yellow green 0 20 dc forward current ? ma 0 0.4 1.8 relative luminous intensity (normalized at 20 ma) hsmx-a100 g 3 35 0.8 0.2 1.0 10 0.6 1.2 25 alingap gap 5 15 30 1.4 1.6 algaas gan ingan 0 3 forward voltage ? v 0 10 30 35 forward current ? ma 5 5 20 15 25 1 2 4 hsmc/j/l/a/e hsmm/k/n hsmh hsms/d/y/g hsmz/v/u hsmb
8 figure 7. radiation pattern. figure 9. recommended wave soldering profle. figure 6. forward voltage shift vs. temperature. figure 8. recommended pb-free refow soldering profle. figure 10. recommended soldering pad pattern. 217 c 200 c 60 - 120 sec. 6 c/sec. max. 3 c/sec. max. (acc. to j-std-020c) 3 c/sec. max. 150 c 255 - 260 c 100 sec. max. 10 to 30 sec. time temperature laminar wave bottom side of pc board hot air knife turbulent wave fluxing preheat 0 10 20 30 50 100 150 200 250 30 40 50 time ? seconds temperature ? c 60 70 80 90 100 top side of pc board conveyor speed = 1.83 m/min (6 ft/min) preheat setting = 150c (100c pcb) solder wave temperature = 245c air knife air temperature = 390c air knife distance = 1.91 mm (0.25 in.) air knife angle = 40 leaded solder: sn63; flux: rma lead-free solder: 96.5 wt% sn, 3 wt% ag, 0.5 wt% cu note: allow for boards to be sufficiently cooled before exerting mechanical force. note: for detail information on refow soldering of avago surface mount leds, do refer to avago application note an 1060 surface mounting smt led indicator components. hsmx-a100 g 6 normalized intensity 1.0 0 angular displacement ? degrees 0.8 0.6 0.2 0.4 -70 -50 -30 0 20 30 50 70 90 -90 -20 -80 -60 -40 -10 10 40 60 80 delta v f (normalized at 25c) -0.3 -100 temperature ? c 0.5 0.4 0.2 0.1 0 -0.2 150 50 -50 0 100 -0.1 0.3 gap/algaas/ alingap ingan/gan 2.60 4.50 1.50 solder resist
9 figure 11. tape leader and trailer dimensions. figure 12. tape dimensions. 200 mm min. for ? 180 reel. 200 mm min. for ? 330 reel. trailer component leader 480 mm min. for ? 180 reel. 960 mm min. for ? 330 reel. c a user feed direction hsmx-a100 g 8 c a 4 0.1 4 0.1 2 0.05 3.05 0.1 3.5 0.05 8 +0.3 ?0.1 1.75 0.1 3.81 0.1 2.29 0.1 0.229 0.01 8 ? 1.5 +0.1 ?0 ?1 +0.1 ?0 hsmx-a100 g 9
10 figure 13. reel dimensions. figure 14. reeling orientation. 14.4 (max. measured at hub) 7.9 (min.) 10.9 (max.) 62.5 2 +0.5 ?0 ? 20.5 0.3 ? 13 0.2 +0 ?2.5 8.4 (measured at outer edge) +1.50 ?0.00 180 label area (111 mm x 57 mm) with depression (0.25 mm) hsmx-a100 g 10 cathode side printed label user feed direction hsmx-a100 g 11
11 intensity bin select (x 5 x 6 ) individual reel will contain parts from one half bin only. x 5 min i v bin x 6 0 full distribution 2 2 half bins starting from x 5 1 3 3 half bins starting from x 5 1 4 4 half bins starting from x 5 1 5 5 half bins starting from x 5 1 6 2 half bins starting from x 5 2 7 3 half bins starting from x 5 2 8 4 half bins starting from x 5 2 9 5 half bins starting from x 5 2 intensity bin limits bin id min. (mcd) max. (mcd) g1 1.80 2.24 g2 2.24 2.80 h1 2.80 3.55 h2 3.55 4.50 j1 4.50 5.60 j2 5.60 7.20 k1 7.20 9.00 k2 9.00 11.20 l1 11.20 14.00 l2 14.00 18.00 m1 18.00 22.40 m2 22.40 28.50 n1 28.50 35.50 n2 35.50 45.00 p1 45.00 56.00 p2 56.00 71.50 q1 71.50 90.00 q2 90.00 112.50 r1 112.50 140.00 r2 140.00 180.00 s1 180.00 224.00 s2 224.00 285.00 t1 285.00 355.00 t2 355.00 450.00 u1 450.00 560.00 u2 560.00 715.00 v1 715.00 900.00 v2 900.00 1125.00 w1 1125.00 1400.00 w2 1400.00 1800.00 x1 1800.00 2240.00 x2 2240.00 2850.00 tolerance of each bin limit = 12%
12 color bin select (x 7 ) individual reel will contain parts from one full bin only. x 7 0 full distribution z a and b only y b and c only w c and d only v d and e only u e and f only t f and g only s g and h only q a, b, and c only p b, c, and d only n c, d, and e only m d, e, and f only l e, f, and g only k f, g, and h only 1 a, b, c, and d only 2 e, f, g, and h only 3 b, c, d, and e only 4 c, d, e, and f only 5 a, b, c, d, and e only 6 b, c, d, e, and f only color bin limits blue min. (nm) max. (nm) a 460.0 465.0 b 465.0 470.0 c 470.0 475.0 d 475.0 480.0 green min. (nm) max. (nm) a 515.0 520.0 b 520.0 525.0 c 525.0 530.0 d 530.0 535.0 cyan min. (nm) max. (nm) a 490.0 495.0 b 495.0 500.0 c 500.0 505.0 d 505.0 510.0 emerald green min. (nm) max. (nm) a 552.5 555.5 b 555.5 558.5 c 558.5 561.5 d 561.5 564.5 orange min. (nm) max. (nm) a 597.0 600.0 b 600.0 603.0 c 603.0 606.0 d 606.0 609.0 e 609.0 612.0 red orange min. (nm) max. (nm) a 611.0 616.0 b 616.0 620.0 red min. (nm) max. (nm) full distribution tolerance of each bin limit = 1 nm. color bin limits amber min. (nm) max. (nm) a 582.0 584.5 b 584.5 587.0 c 587.0 589.5 d 589.5 592.0 e 592.0 594.5 f 594.5 597.0 yellow green min. (nm) max. (nm) e 564.5 567.5 f 567.5 570.5 g 570.5 573.5 h 573.5 576.5
packaging option (x 8 x 9 ) option test current package type reel size j1 20 ma top mount 7 inch j4 20 ma top mount 13 inch h1 20 ma reverse mount 7 inch h4 20 ma reverse mount 13 inch j2 10 ma top mount 7 inch j5 10 ma top mount 13 inch h2 10 ma reverse mount 7 inch h5 10 ma reverse mount 13 inch l2 2 ma top mount 7 inch for product information and a complete list of distributors, please go to our website: www.avagotech.com avago, avago technologies, and the a logo are trademarks of avago technologies in the united states and other countries. data subject to change. copyright ? 2005-2013 avago technologies. all rights reserved. obsoletes av01-0040en av02-0198en - july 5, 2013 moisture sensitivity this product is qualifed as moisture sensitive level 2a per jedec j-std-020. precautions when handling this moisture sensitive product is important to ensure the reliability of the product. do refer to avago application note an5305 handling of moisture sensitive surface mount devices for details. a. storage before use - unopen moisture barrier bag (mbb) can be stored at <40c/90%rh for 12 months. if the actual shelf life has exceeded 12 months and the hic indicates that baking is not required, then it is safe to refow the leds per the original msl rating. - it is not recommended to open the mbb prior to assembly (e.g. for iqc). b. control after opening the mbb - the humidity indicator card (hic) shall be read im - mediately upon opening of mbb. - the leds must be kept at <30c / 60%rh at all time and all high temperature related process including soldering, curing or rework need to be completed within 672 hours. c. control for unfnished reel - for any unuse leds, they need to be stored in sealed mbb with desiccant or desiccator at <5%rh. d. control of assembled boards - if the pcb soldered with the leds is to be subjected to other high temperature processes, the pcb need to be stored in sealed mbb with desiccant or desic - cator at <5%rh to ensure no leds have exceeded their foor life of 672 hours. e. baking is required if: - 10% is not blue and 5% hic indicator turns pink. - the leds are exposed to condition of >30c / 60% rh at any time. - the leds foor life exceeded 672 hours. recommended baking condition: 605c for 20 hours.

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